SMT High Speed Semi Automatic Dicing Machine for Production Line
The dicing system utilizes a slim cutting blade mounted on a high-speed spindle to precisely cut materials including glass, ceramic, semiconductor chips, PCB, EMC wire frames, and other substrates with exceptional accuracy.
Operation Procedures
Wafer or Strip
Tape mounting
Dicing
Cleaning
UV separation
Semi-Automatic Dicing System Description
The semi-automatic dicing system features manual loading and unloading operations while automating the core dicing procedure. This system does not include automatic cleaning or drying functions.
Main Procedures
Feeding by hand
Position align
Auto-cutting
Unloading by hand
- Operator manually places cutting material on work platform
- Automatic calibration of cutting position
- Press start button to automatically complete dicing process
- Operator manually removes finished material from work platform
Applications
Automatic dicing systems are widely used for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.
Ceramic substrate
Silicon rubber
Lead frame
Operating Requirements
- Use clean compressed air with atmospheric pressure dew point of -10°C to -20°C, residual oil content of 0.1ppm, and filtration accuracy above 0.01μm/99.5%
- Operate in environment temperature of 20°C to 25°C with fluctuation range controlled at ±1°C
- Maintain cutting water temperature at 22°C to 27°C (±1°C variation) and cooling water at 20°C to 25°C (±1°C variation)
- Avoid external impacts and vibrations; do not install near high-temperature devices like blowers or vents, or equipment generating oil mist
- Strictly follow provided product manual for operation
YSL-1000SD Semi-Dicing System Features
| Control Interface |
Touch LCD with simple interface design, multiple language support (Chinese, English, Korean) |
| Maximum Material Size |
300mm diameter high precision cutting capability |
| Structural Design |
High rigidity design ensuring precision and stability during cutting process |
| Alignment System |
CCD automatic alignment |
| Monitoring System |
Real-time monitoring of air pressure, water pressure, current values to prevent spindle damage |
| Cutting Spindle |
2.4 kW × 1 set (Maximum: 60,000 rpm) |
| Positioning Accuracy |
0.001mm repeat positioning accuracy |
| Cutting Speed |
0.05 ~ 400 mm/sec |
| Standard Blade |
2 Inch (Maximum: 3 Inch) |
Case Sharing
Optional Equipment
- Blade damage detection function
- Automatic setting function
- Dicing visual function
- 3-inch dicing blade compatibility
Platform Capacity Comparison
Standard 8-inch working platforms accommodate only 2 pieces of material. The SDS1000/ADS2000 models feature 12-inch chucks capable of holding 4 pieces per cycle, reducing loading times, accommodating larger products, and improving efficiency by over 8%.
