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YUSH Electronic Technology Co.,Ltd
YUSH Electronic Technology Co.,Ltd Professional in PCB depaneling machine & PCB separator since 2005.
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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

Place of Origin : Guangdong, China

Brand Name : YUSH

MOQ : 1 set

Price : $4,000 / set

Weight : 110 kg

Power : 10 kW

Voltage : 220V/110V

Model : YSPP-1A

Size : 500mm X 750mm X 910mm

Work Air Pressure : 0.5-0.7MPA

Working Area : 110mm X 150mm

Temperature Range : 0-400℃

Temperature Tolerance : +2℃

Pressing Time : 0-99s

Pressing Tolerance : 0.05MPA

Bonding Force : 3,900N

Heat Seal Pitch : 0.25mm

Core Components : PLC, Gearbox, Motor, Pump

Cycle Time : Extremely short

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FPC to PCB Board Pulse-Heated Soldering/Welding Machine
High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management.
Technology Overview
Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding technology utilizes thermode-based rapid reflow through pulse heating, enabling materials with low temperature resistance to be soldered at high lead-free temperatures without damaging flexible circuits. The process selectively heats components to melt adhesive or solder, which then re-solidifies to form permanent, reliable bonds.
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
Key Features
  • Extremely short cycle time with rotary table design allowing product loading/unloading during heat sealing process
  • High quality heat seal application for pitches up to 0.25mm
  • Pneumatic bonding head delivering up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Bonding cycle triggered by real-time pressure sensor
  • Floating thermode ensuring consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with micrometer alignment and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control system
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
Technical Specifications
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA

Product Tags:

FPC to PCB soldering machine

      

high-precision thermal bonding equipment

      

PCB depaneling welding machine

      
Quality FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment for sale

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